EVG ® 120

Automated Resist Processing System

The EVG ® 120 is a fully automated resist processing system designed for both low-volume and high-volume manufacturing, supporting wafers up to 200 mm

The next generation of the well-established EVG 120 features a new robot system, optimized parallel processing, a modular tool design, an optimized dispensing system, and a post-processing unit that includes wafer edge exposure. In addition, the system offers significant economic benefits such as yield improvement through in-situ resist thickness measurement, reduced cost of ownership with its compact footprint and optimized chemical usage as well as lower energy consumption via standby mode. The new EVG 120 can process a large variety of materials such as thin and thick resists, dielectrics, colored resists, and adhesives for applications in photolithography, wafer bonding and nanoimprint lithography. The coating thickness can range from 100 nm to several hundred µm.

Features

Wafer sizes up to 200 mm

Ultra-compact design with reduced footprint <1.9m 2

Up to 2 coating or development modules and 14 hot/chill plates

Flexible modular configuration featuring spin coating / spray coating / development

Up to 6 pumps and resist bottles integrated into the base frame; pumps and resists in shortest distance to point of use

CoverSpin™ bowl design providing superior uniformity and reduced material consumption

Proprietary OmniSpray® ultrasonic atomization technology for conformal coating of topography wafers and fragile substrates

User friendly GUI with multi–user concept

New CIMFramework software featuring smart process control and data analysis features Equipment and process performance tracking and data analysis features Parallel/queueing task processing feature Smart handling features Smart maintenance and tracking features

Equipment and process performance tracking and data analysis features

Parallel/queueing task processing feature

Smart handling features

Smart maintenance and tracking features