EVG ® 301
EVG 301
Single Wafer Cleaning System。R&D type single wafer cleaning system
广西科米瑞实验仪器设备有限公司提供 EV Group EVG 301 产品资料、选型咨询、供货报价和售后服务支持，价格面议。
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说明
Single Wafer Cleaning System
R&D type single wafer cleaning system
The EVG301 semi-automated single wafer cleaning system employs one cleaning bowl. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding, or it can be combined with EVG’s debondig systems to remove the temporary bonding adhesive after debond.
Features
Available for aqueous based cleaning applications such as silicon direct bonding
Available for solvent based cleaning applications such as post-debond cleans
High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
Brush scrubbing for single-side cleaning (option)
Diluted chemicals for wafer cleaning
Prevents cross-contamination from back to front side
Fully software-controlled cleaning process
Options Pre-bonding station with IR-inspection Tooling for non-SEMI standard substrates
Pre-bonding station with IR-inspection
Tooling for non-SEMI standard substrates
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