EVG ® 610 BA
EVG 610 BA
Bond Alignment System。Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 610 BA，可提供产品参数、报价和售后服务咨询，价格面议。
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Bond Alignment System
Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research
The EVG610 bond alignment system offers a manual high-precision alignment stage with bottom-side microscope. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
Most suitable for EVG ® 501 and EVG ® 510 bonding systems
Wafer and substrate sizes up to 150 / 200 mm
Manual high-precision alignment stage
Manual-operated bottom-side microscope
Windows ® based user interface
Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
Desktop system design with minimum footprint
Supports IR alignment process
Optimum total cost of ownership (TCO) for R&D and pilot line production
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