EVG ® 620 BA
EVG 620 BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for research and pilot production
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 620 BA，可提供产品参数、报价和售后服务咨询，价格面议。
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Automated Bond Alignment System
Automated bond alignment system for wafer-to-wafer alignment for research and pilot production
Known for its high level of automation and reliability, the EVG620 bond alignment system offers high precision, flexibility and ease of use in numerous production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
Most suitable for EVG ® 501, EVG ® 510, and EVG ® 520 IS bonding systems
Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
Manual or motorized alignment stage
Fully motorized high-resolution bottom-side microscopes
Windows ® based user interface
Quick tool change between different wafer sizes and different bonding applications
Options Automatic alignment IR alignment for inner substrate key alignment NanoAlign ® package for enhanced process capabilities Available with system rack Upgrade possibility to mask aligner
Automatic alignment
IR alignment for inner substrate key alignment
NanoAlign ® package for enhanced process capabilities
Available with system rack
Upgrade possibility to mask aligner
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