EVG ® 6200∞ BA
EVG 6200∞ BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for pilot and volume production
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 6200∞ BA，可提供产品参数、报价和售后服务咨询，价格面议。
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Automated Bond Alignment System
Automated bond alignment system for wafer-to-wafer alignment for pilot and volume production
The EVG®6200∞ BA bond alignment system offers the high precision, flexibility and ease of use in numerous production environments. The precision of EVG bond aligners accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
Suitable for all EVG 200 mm bond systems
Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
Manual or motorized alignment stage with automatic alignment option
Fully motorized high-resolution bottom-side microscopes
Windows ® based user interface
Options Automatic alignment IR alignment for inner substrate key alignment NanoAlign ® package for enhanced process capabilities Available with system rack Upgrade possibility to mask aligner
Automatic alignment
IR alignment for inner substrate key alignment
NanoAlign ® package for enhanced process capabilities
Available with system rack
Upgrade possibility to mask aligner
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