EVG ® 805
EVG 805
Debonding System。Thin wafer debonding。The EVG805 is a system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an inter
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 805，可提供产品参数、报价和售后服务咨询，价格面议。
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Debonding System
Thin wafer debonding
The EVG805 is a system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
Features
Open adhesive platform
Debond Options: Thermal slide off debonding Lift off debonding Mechanical debonding
Thermal slide off debonding
Lift off debonding
Mechanical debonding
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Unique features for thin-wafer handling
Various chuck designs to support wafer/substrates and carriers up to 300 mm
High topography wafer handling
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