EVG ® 850
EVG 850
Automated Production Bonding System for SOI。Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
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Automated Production Bonding System for SOI
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.
Features
Production system built to operate in high-throughput, high-yield environments
Automated cassette-to-cassette or FOUP-to-FOUP operation
Contamination-free backside handling
Megasonic and/or brush cleaning
Pre-bonding with mechanical flat or notch alignment
Advanced remote diagnostics
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