EVG ® 850 DB
EVG 850 DB
Automated Debonding System。Fully automated debonding, cleaning and unloading of thin wafers
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Automated Debonding System
Fully automated debonding, cleaning and unloading of thin wafers
The EVG®850 DB is a fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks. The fragile device wafers are always supported either through film frame mounting or through a thin wafer handler.
Features
Reliable handling of thinned, bowed and warped wafers with and without topography
Automated cleaning of debonded wafer
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Fully integrated SECS/GEM interface in automated tools
Bridge tool capability for different substrate sizes
Modular tool layout → throughput-optimized depending on specific process
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