EVG ® 850 LT
EVG 850 LT
Automated Production Bonding System for SOI and Direct Wafer Bonding
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说明
Automated Production Bonding System for SOI and Direct Wafer Bonding
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free bonds.
Features
SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
Suitable for a wide range of fusion/molecular wafer bonding applications
Production system built to operate in high-throughput, high-yield environments
Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
Contamination-free backside handling
Megasonic and/or brush cleaning
Pre-bonding with mechanical flat or notch alignment
Advanced remote diagnostics
FAQ
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