EVG ® 850 TB
EVG 850 TB
Automated Temporary Bonding System。Fully automated temporary wafer bonding of a substrate on a rigid carrier
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Automated Temporary Bonding System
Fully automated temporary wafer bonding of a substrate on a rigid carrier
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process.
Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.
Features
Open adhesive platform
Various carriers (silicon, glass, sapphire, etc…)
Bridge tool capability for different substrate sizes
Available with multiple load port options and combinations
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Fully integrated SECS/GEM interface
Optional integrated inline metrology module for automated feedback loop
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