SmartView ® NT

Automated Bond Alignment System for Universal Alignment

Fully automated bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment

The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. The tool is well suited for applications such as wafer stacking for 3D interconnects, wafer-level-packaging and high-volume MEMS devices.

Features

Suitable for automated and integrated EVG bonding systems (EVG ® 560, GEMINI ® ) in 200 mm and 300 mm configurations

Universal bond aligner (face-to-face-, backside-, infrared- and transparent alignment)

No Z-axis motion and no refocusing required

Windows® based user interface

Bond pairs are aligned and clamped prior to loading into the bond chamber

Manual or fully automated configurations (e.g. integration with GEMINI ® )

Options Can be combined with the EVG ® 500 series wafer bonding systems, EVG ® 300 series cleaning systems and EVG ® 810 LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation

Can be combined with the EVG ® 500 series wafer bonding systems, EVG ® 300 series cleaning systems and EVG ® 810 LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation