PEROVSKITE
Thin Film Deposition Platforms Designed for Optimized Vacuum Processing of Perovskite Devices
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:Thin Film Deposition Platforms Designed for Optimized Vacuum Processing of Perovskite Devices
:The Kurt J. Lesker Company ® PEROVSKITE system series is an advanced thin film deposition platform engineered for substrates up to 210 mm x 210 mm, leveraging eKLipse control software for precise process management. The PEROVSKITE series extends the capabilities of the SPECTROS architecture, with a chamber specifically optimized for vacuum-based perovskite deposition. The system incorporates enhanced pump protection and cooling shrouds to mitigate cross-contamination and address the volatility of perovskite precursors.
:Perovskite devices have emerged in the last decade as a potentially highly disruptive technology in the commercial solar and semiconductor market. Progress has been rapid, with current perovskite solar cells (PSCs) already showing performance comparable to similar silicon-based devices, while silicon-perovskite tandem structures are giving efficiencies significantly exceeding that of the silicon alone.
:Vacuum evaporation of the perovskite precursor materials can be challenging, necessitating thoughtful system design and hardware components developed to meet the requirements of the application.
:A Kurt J Lesker physical vapor deposition tool was used in the pioneering work which first reported vacuum evaporation as a viable processing technique for metal halide perovskite (MHP) films, and our tools have been used extensively in perovskite solar cell research ever since.
:Interested in a tool for vacuum processing of perovskite devices? Then let's look at the key building blocks you will need:
:KJLC Dual Wedge Tool turns your single substrate into multiple substrates without the need for breaking vacuum or complex masking. This Combinatorial (producing multiple substrates with different materials and thicknesses on a single substrate) approach cuts down expensive and prolonged research time allowing for large amounts of substrate variations to be completed in days instead of months.
:Up to 16 LTE sources, four thermal evaporation sources, mask changing and dual wedge tool.
:Features Available on PEROVSKITE SERIES Systems
:Inert Environment
:Engineered for seamless glovebox integration, our entire product line supports the creation and maintenance of inert atmospheres, enabling precise manipulation and evaluation of air-sensitive compounds and devices. This ensures optimal sample integrity and minimizes contamination risk for processes requiring controlled environments.
:Low Temperature Evaporation (50-600°C)
:Optimized evaporation sources capable of stable operation across a broad low-temperature range, enabling effective deposition of volatile perovskite precursors. This ensures high material utilization and uniform film formation, critical for device performance and yield. Water cooled shroud and removable sources shown.
:Co-Deposition Capability
:Standardized control of multiple simultaneous evaporation sources allows for precise fabrication of complex, multi-component thin films. This enables advanced device architectures and tailor material properties for next-generation perovskite devices.
:HydraVap Low Temperature Sources
:The water-cooled HydraVap low temperature sources enable rapid cooling, resulting in shorter takt times, effectively streamlining production cycles and improving throughput.
:Load Lock Integration
:Load lock options enable rapid sample exchange under vacuum, minimizing exposure to ambient conditions. This reduces takt time, increases productivity, and preserves the integrity of sensitive deposition materials. Ideal for both research and industrial settings.
:High Deposition Source Count, Space-Optimized Design
:The system's compact architecture supports a high density of evaporation sources, facilitating high-throughput materials research and the fabrication of complex multi-layer stack structures. Accelerated experimental cycles made possible by this space-optimized design.
:Atomic Layer Deposition (ALD)
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