GIGAbatch 360/380P
GIGAbatch 360/380P
Plasma Surface Treatment。Plasma Frontend。GIGAbatch 360P/380P。The plasma systems GIGAbatch 360P and 380P are suitable for the most challenging requirements in the semiconductor i
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Plasma Surface Treatment
Plasma Frontend
GIGAbatch 360P/380P
The plasma systems GIGAbatch 360P and 380P are suitable for the most challenging requirements in the semiconductor industry and use the same chamber geometry. The 360P model, with a chamber diameter of 245 mm, can hold up to 50 wafers with a diameter of 150 mm. In the 380P system, the chamber has an inner diameter of 300 mm and therefore space for 25 wafers with a diameter of 200 mm. The difference from the systems in the M series is the compatibility of the P systems with the requirements of cleanrooms up to class 100.
The GIGAbatch 380P is a fully automated system for loading and unloading complete wafer batches.
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