中文English
科米瑞
首页联系我们
  1. 首页
  2. 产品中心
  3. 产品详情
科米瑞

© Copyright 科米瑞 2026

产品中心产品目录应用领域知识中心常见问题联系我们隐私政策桂ICP备2020008265号-5
广西科米瑞实验仪器设备有限公司13422079856122816084@qq.com
分析检测仪器生命科学仪器显微成像与光学样品前处理温控加热与制冷真空泵阀与流体科米瑞仪器应用领域实验室仪器选型

scia Batch 350

scia Batch 350

Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...

品牌: scia Systems价格: 面议服务区域: 全国

广西科米瑞实验仪器设备有限公司提供 scia Systems scia Batch 350 产品资料、选型咨询、供货报价和售后服务支持,价格面议。

立即询价查看更多详情咨询该型号
← 返回产品列表
scia Batch 350
说明规格FAQ

说明

Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...

Ion Beam Etching

Ion Beam Trimming

Ion Beam Sputtering

scia Cluster 200

Technologies

Applications Application Notes White Paper Publications Research Projects Learning

Application Notes

White Paper

Publications

Research Projects

Learning

Company About us News Events

About us

Contact Head Office Worldwide Visit us

Head Office

Worldwide

Visit us

scia-jobs.de

3D-Coatings in Batches

The scia Batch 350 is designed for biocompatible coatings of 3‑dimensional shaped substrates. Thereby, the carrier concept enables different substrate sizes and shapes in one batch. With its stable, reproducible and certified process, the system meets the high quality standards for treatment of medical objects.

Features & Benefits

Coating of different substrate sizes and quantities in batches due to carrier loading

Two independent RF electrodes for high throughput

Homogeneous “all-around coating” by individual rotation of each substrate

Superior barrier performance and fully cohesive film, also during mechanical deformation

Combination of heating, plasma pre-treatment and PECVD coating

Flexible gas and RF conditions

Need more Information? Contact us!

Applications

Stent for vascular intervention, PRO-Kinetic Energy © BIOTRONIK

3-dimensional barrier coating of biocompatible films for medical implants (pacemakers, stents)

Principle

RF parallel plate arrangement with rotation of each substrate for a uniform coating of all sides

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a plasma assisted reactive process to deposit thin films from a gas state (vapor) into a solid state on a substrate.

Detailled Information

Substrate size

Individual sizes loaded on 2 carriers, carrier size up to 350 mm x 240 mm

Substrate carrier

Water-cooled, pulsed DC bias (2 kV, 400 mA)

规格

型号scia Batch 350
Product categoryPecvd Rie
Substrate sizeIndividual sizes loaded on 2 carriers, carrier size up to 350 mm x 240 mm
Substrate carrier

提交需求

请填写必填信息,我们将在工作日尽快回复。

Water-cooled, pulsed DC bias (2 kV, 400 mA)
Plasma sourceRF parallel plate arrangement, 13.56 MHz
电源电压RF power max. 2 x 600 W
Electrode setupTemperature: heating up to 400 °C; distance: adjustable between 50 mm and 150 mm
Operation modesIndependent or coupled electrodes
Base pressure< 5 x 10 -7 mbar
System dimension (W x D x H)0.90 m x 1.70 m x 2.10 m (without electrical rack and pumps)
ConfigurationSingle chamber with manual loading in batches
Software interfacesSECS II / GEM, OPC
Typical deposition rateSiC: 5 nm/min

FAQ