scia Cluster 200
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The All-in-One Cluster Solution
The scia Cluster 200 is a modular platform for coating, etching, and cleaning processes based on advanced ion beam and plasma technologies. A cluster uses multiple identical process chambers to achieve a significant throughput increase, or integrates different process technologies for sequential process steps on a single wafer without a vacuum break.
The scia Cluster 200 system can be configured individually for each customer's application, allowing up to five process chambers and one or two load locks to be installed around the central transfer chamber.
Benefits of a Cluster System
Modular platform with multiple processes in one system or several identical process chambers
Highest flexibility, choosing from an extensive technology portfolio for deeply customized solutions
Scalable platform with individual chamber quantity for increased throughput and efficient production
Less contamination and reduced total cycle time by continuous process chain without vacuum interruption
Lower total cost of ownership with smaller footprint and less utility consumption
Easy-to-use software for centralized recipe-based cross-chamber processing, boosting efficiency and flexibility
You have the choice
Multi-process cluster
Multiple process chambers with different processes
Cost-effective & scalable production with high consistency and efficiency
Several process steps can run sequentially or in parallel on the platform
Less contamination by substrate movement without air exposure
Reduces process time and increases yield
scia Cluster 200 - the all-in-one multi-process cluster solution
Single-process cluster
All process chambers perform the same process
High reliability and volume production for processes requiring critical uptime and throughput
Increased throughput by simultaneous processing across multiple chambers
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| 型号 | scia Cluster 200 |
|---|---|
| Product category | Ion Beam Etching |
| Available process modules | CORE TECHNOLOGY MODULES; Magnetron Sputtering; Electron Beam Evaporation (EBE); Ion Beam Etching (IBE); ADD-ON MODULES; Plasma Enhanced Chemical Vapor Deposition (PECVD); Pre-Cleaning with Reactive Ion Etching (RIE) |