scia Magna 200
scia Magna 200
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Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
Ion Beam Etching
Ion Beam Trimming
Ion Beam Sputtering
scia Cluster 200
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Advanced Wafer Coatings
The scia Magna 200 is used for precision wafer coatings by deposition of metals and/or dielectric layers. With its selectable sputter modes and arrangements the system can be configured according the customer requirements. In addition, the system is suitable for small scale R&D applications as well as for mass production, in cluster layout with software controlled automatic production.
Features & Benefits
RF bias for conformity and stress control
Superior uniformity with rotatable substrate holder
Low substrate temperature with helium cooling contact and electrostatic chuck
High deposition rates with reactive sputtering in unipolar and bipolar mode
Variation of film properties by adjustable energetic substrate bombardment
Co-sputtering with confocal arrangement of magnetrons
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Cluster layout with 2 process chambers and cassette handling
Single chamber with single substrate load lock
Applications
Reactive sputter deposition of silicon dioxide in confocal arrangement with bipolar pulsed DC on a 150 mm dia. Si wafer. Uniformity variation < 0.8 % (σ/mean), stress -300 MPa,
deposition rate 7 nm/min. Refractive index of 1.48 indicates stoichiometric and dense silicon dioxide deposition.
Temperature compensation films for TC-SAW devices (SiO 2 )
Piezoelectric films with excellent and defined crystal orientation (AlN, AlScN) and electrode materials (Mo)
Optical high- and low- refractive coatings (SiO 2 , TiO 2 , HfO 2 , ZrO 2 , Nb 2 O 5 , Ta 2 O 5 )
Electrical insulating films (Si 3 N 4 , SiO 2 , Al 2 O 3 )
Co-sputtering of metals and alloys
Application Note
规格
| 型号 | scia Magna 200 |
|---|---|
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