Name: scia Mill 200
Brand: scia Systems
SKU: https://www.scia-systems.com/products/ion-beam-etching/scia-mill-200
Availability: InStock

Question 1

scia Mill 200的品牌和型号是什么？

Accepted Answer

当前页面显示，产品名称为scia Mill 200，型号为scia Mill 200，品牌为scia Systems。

Question 2

scia Mill 200属于哪个产品分类？

Accepted Answer

当前页面分类信息显示，scia Mill 200归入未在当前页面列出。如同一产品存在多个配置，应以页面列出的型号和规格字段进行区分。

Question 3

scia Mill 200当前页面有哪些用途说明？

Accepted Answer

当前页面对scia Mill 200的用途或产品说明为：Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...

Question 4

scia Mill 200有哪些已公开规格参数？

Accepted Answer

当前页面已公开的scia Mill 200规格参数包括：Model：scia Mill 200；Product category：Ion Beam Etching；Substrate size (up to)：200 mm dia.；Substrate holder：Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps；Ion beam source：350 mm circular RF source (RF350-e)；Neutralizer：RF plasma bridge neutralizer (N-RF)。

Question 5

scia Mill 200选型时应优先核对哪些页面信息？

Accepted Answer

选型scia Mill 200时，应优先核对当前页面已经公开的产品名称、型号、品牌、分类和规格字段。当前可参考的信息为：型号 scia Mill 200；品牌 scia Systems；分类 未在当前页面列出；Model：scia Mill 200；Product category：Ion Beam Etching；Substrate size (up to)：200 mm dia.；Substrate holder：Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps；Ion beam source：350 mm circular RF source (RF350-e)；Neutralizer：RF plasma bridge neutralizer (N-RF)

Question 6

scia Mill 200是否有详细正文介绍？

Accepted Answer

当前页面已收录scia Mill 200的正文资料，摘要为：Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more... Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 Technologies Applications Application Notes White Paper Publications Research Projects Learning App...

Question 7

scia Mill 200是否可以用于参数对比？

Accepted Answer

scia Mill 200可以基于当前页面规格字段进行初步参数对比。已公开字段包括：Model：scia Mill 200；Product category：Ion Beam Etching；Substrate size (up to)：200 mm dia.；Substrate holder：Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps。

Question 8

scia Mill 200采购沟通时应提供哪些已知信息？

Accepted Answer

围绕scia Mill 200沟通采购需求时，可直接提供当前页面已知信息：产品名称 scia Mill 200，型号 scia Mill 200，品牌 scia Systems，分类 未在当前页面列出，关键规格 Model：scia Mill 200；Product category：Ion Beam Etching；Substrate size (up to)：200 mm dia.。

Question 9

scia Mill 200适合用于初步选型和询价沟通吗？

Accepted Answer

可以。当前页面整理了scia Mill 200的产品说明、图片和已公开规格，适合用于初步选型、型号核对和采购沟通；具体配置与报价建议提交需求后确认。

Question 10

询价scia Mill 200时建议提供哪些信息？

Accepted Answer

询价scia Mill 200时，建议提供使用场景、样品类型、目标参数、数量、交付地区以及是否需要安装和售后支持，便于确认型号配置和报价。

型号	scia Mill 200
Product category	Ion Beam Etching
Substrate size (up to)	200 mm dia.
Substrate holder	Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
Ion beam source	350 mm circular RF source (RF350-e)
Neutralizer	RF plasma bridge neutralizer (N-RF)
Throughput	12 Wafer/h (100 nm SiO 2 on 200 mm wafer)
Base pressure	< 5 x 10 -7 mbar
System dimension (W x D x H)	3.20 m x 2.50 m x 2.50 m, for 3 chambers and cassette handling (without electrical racks and pumps)
Configurations	Single chamber, optional single substrate load lock or cassette handling, cluster system with up to 3 process chambers and cassette handling, optional OES or SIMS based end point detection
Software interfaces	SECS II / GEM, OPC
Typical removal rates	Cu: 60 nm/min, Pt: 35 nm/min, W: 18 nm/min, SiO 2 : 20 nm/min (inert), SiO 2 : 40 - 60 nm/min (reactive)
Uniformity variation	≤ 1 % (σ/mean)

scia Mill 200

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