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scia Mill 300

scia Mill 300

Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...

品牌: scia Systems价格: 面议服务区域: 全国

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scia Mill 300

Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...

Ion Beam Etching

Ion Beam Trimming

Ion Beam Sputtering

scia Cluster 200

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Structuring of Complex Multilayers on 300 mm Wafers

The scia Mill 300 is designed for ion beam etching of various substrate materials with up to 300 mm dia. Different end point detection systems allow accurate process control, and the system's full reactive gas compatibility enables reactive etch processes with improved selectivity and rate. Due to the flexible design of the scia Mill 300, the system can be used both for high-volume production with cassette loading as well as for small scale production with a single substrate load-lock.

Features & Benefits

Etching angle adjustment with tiltable and rotatable substrate holder

Excellent uniformity without shaper

Enhanced selectivity and rate with reactive gases

Process control with exact SIMS based or optical end point detection

Processing of wafers with photoresist masks due to good wafer cooling

Fully automatic cassette handling in variable cluster layouts including SECS/GEM communication

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Applications

Reactive ion beam etching of slanted surface relief gratings (SRG) as optical couplers for Augmented Reality (AR). Left: Ion beam etching under different angles of incidence. Right: Etched quartz grating from principle and SEM result.

Structuring of magnetic memory (MRAM) and sensors (GMR, TMR, etc.)

Structuring of metals (Au, Ru, Ta, …), piezoelectric, and dielectric materials (PZT, KNN, AlScN, InP, Cu, Pt, Au, ...), e.g., for MEMS production

Delayering of multilayer structures for failure analysis

Patterning of waveguides (LiNbO 3 , BTO, …) for Photonic Integrated Circuits (PIC)

Production of slanted surface relief gratings (SRG) for Augmented Reality

Chemically Assisted Ion Beam Etching (CAIBE) of compound semiconductors (GaAs, GaN, InP, …)

Ion beam smoothing for reduction of microroughness

Surface Relief Gratings for AR- and MR-Devices

Magnetic Multilayers for tunnel-magneto-resistance (TMR) sensors

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