SB8
SB8 Gen2 wafer bonder is a semi-automated universal wafer 键合 system capable of handling wafers up to 200 mm. Discover now ➤
广西科米瑞实验仪器设备有限公司提供 SUSS SB8 产品资料、选型咨询、供货报价和售后服务支持,价格面议。
← 返回产品列表
Your Universal Wafer 键合 System
Key Features of SB8 Gen2 Wafer Bonder
Equipped with an adjustable, high performance bond chamber, the SB8 Gen2 adapts easily to changing process requirements. Temperature control, bond force, and chamber pressure can be flexibly set to meet your specific production needs.
Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.
请填写必填信息,我们将在工作日尽快回复。