XB8
XB8 is a universal, semi-automated high-force wafer bonder, supporting substrates with a wafer size of up to 200 mm. Discover now ➤
广西科米瑞实验仪器设备有限公司提供 SUSS XB8 产品资料、选型咨询、供货报价和售后服务支持,价格面议。
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Key Features of XB8 Wafer Bonder
Versatile high-force 键合
Equipped with a configurable bond chamber, the XB8 adapts easily to changing process requirements. Temperature, bond force, and chamber pressure can all be flexibly controlled by a process recipe to meet your specific production needs.
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