XBC300 Gen2 SP 表面制备 集群系统
XBC300
XBC300 Gen2 SP is your fully automated solution for sequential die-to-wafer hybrid 键合 on 200mm and 300mm substrates with third party hybrid bondern. Discover now ➤
广西科米瑞实验仪器设备有限公司提供 SUSS XBC300 产品资料、选型咨询、供货报价和售后服务支持，价格面议。
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说明
表面制备 for global production and R&D
Key Features of XBC300 Gen2 SP
Designed as a pure 表面制备 solution without an integrated 键合 module, the system enables seamless compatibility with a wide range of stand-alone D2W bonders. Leveraging SUSS’s expertise in wet processing technologies, the XBC300 Gen2 SP provides a flexible and scalable approach for both high-volume manufacturing and R&D environments, enabling customers to integrate best-in-class 表面制备 into their existing hybrid 键合 ecosystems.
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