Tescan
SOLARIS X 2
Deep Cross-Sectioning and Precision End-Pointing for Advanced Package Failure Analysis
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说明
Deep Cross-Sectioning and Precision End-Pointing for Advanced Package Failure Analysis
Tescan SOLARIS X™ 2 is built for laboratories where package-level failure analysis, large-area cross-sectioning, and Ga-free sample preparation demand both speed and precision. Powered by the Mistral™ Xe Plasma FIB column, SOLARIS X™ 2 delivers high-current milling with exceptional surface quality, while the Triglav™ SEM column ensures nanometer-scale imaging accuracy at the beam coincidence point. The result: fast, artifact-free cross-sections and reliable results across advanced IC packages, MEMS, and display devices.
High-throughput Plasma FIB-SEM for efficient large-area and deep cross-sectioning
Nanometer-precision end-pointing with Triglav™ SEM imaging at the FIB-SEM coincidence point
Artifact-free cross-sections using Rocking Stage and TRUE X-sectioning technology
规格
| Brand | TESCAN |
|---|---|
| Model / series | SOLARIS X 2 |
| Instrument class | FIB-SEM |
| Primary workflow | Advanced FIB-SEM imaging, preparation and tomography |
| Product family | FIB-SEM Solutions |
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