Transmute™
brings ALD precision to high-volume production. Built on Beneq’s proprietary 3-step ALD approach – combining plasma pre-treatment, plasma-enhanced ALD, and thermal batch ALD – i...
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High Throughput ALD Platform for Wide Bandgap Power, RF and Other Specialty Devices
Wide bandgap power and RF devices demand conformal films, robust dielectrics, and atomic-level engineering across increasingly complex device architectures. Conventional deposition methods often fall short in meeting these requirements at manufacturing scale.
Beneq Transmute™ brings ALD precision to high volume production. Built on Beneq’s proprietary 3-step ALD approach – combining plasma pre-treatment, plasma-enhanced ALD, and thermal batch ALD – it enables stable interfaces and uniform films across varied topographies.
With proven reliability, scalable architecture, and lower cost of ownership, Transmute™ supports the mass production of next-generation power, RF and other specialty devices.
Overcome the toughest integration challenges
Conformal dielectrics, passivation, and interface control for advanced GaN, SiC, and RF devices – across topographies where conventional methods fall short.
Scale without compromise
Production-ready ALD platform delivering consistent results with reduced cost of ownership. Proprietary chamber design and advanced precursor dosing for 200 mm fabs.
Expand what ALD can do
Thermal and plasma-enhanced ALD in one configurable cluster. Dedicated tool configurations tailored to your application and process requirements.
Looking to adopt ALD in your product design and production
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