Transmute™
brings ALD precision to high-volume production. Built on Beneq’s proprietary 3-step ALD approach – combining plasma pre-treatment, plasma-enhanced ALD, and thermal batch ALD – i...
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High Throughput ALD Platform for Wide Bandgap Power, RF and Other Specialty Devices
Wide bandgap power and RF devices demand conformal films, robust dielectrics, and atomic-level engineering across increasingly complex device architectures. Conventional deposition methods often fall short in meeting these requirements at manufacturing scale.
Beneq Transmute™ brings ALD precision to high volume production. Built on Beneq’s proprietary 3-step ALD approach – combining plasma pre-treatment, plasma-enhanced ALD, and thermal batch ALD – it enables stable interfaces and uniform films across varied topographies.
With proven reliability, scalable architecture, and lower cost of ownership, Transmute™ supports the mass production of next-generation power, RF and other specialty devices.
Overcome the toughest integration challenges
Conformal dielectrics, passivation, and interface control for advanced GaN, SiC, and RF devices – across topographies where conventional methods fall short.
Scale without compromise
Production-ready ALD platform delivering consistent results with reduced cost of ownership. Proprietary chamber design and advanced precursor dosing for 200 mm fabs.
Expand what ALD can do
Thermal and plasma-enhanced ALD in one configurable cluster. Dedicated tool configurations tailored to your application and process requirements.
Looking to adopt ALD in your product design and production
Visit our FAQ page for expert guidance.
Speak to an expert about Beneq Transmute™
| 型号或系列 | Transmute™ |
|---|---|
| 产品类别 | High-volume semiconductor ALD platform |
| 包含型号 | Beneq Transmute |
| Wafer size | 200 mm fabs |
| Application | RF and Other Specialty Devices Wide bandgap power and RF devices demand conformal films, robust dielec |
| Process type | plasma-enhanced ALD, and thermal batch ALD – it enables stable interfaces and uniform films across varied topographies |
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