EVG ® 40 D2W

Die-to-Wafer Overlay Metrology System

Dedicated Die-to-Wafer overlay metrology platform for 100 percent die overlay measurement

The EVG®40 D2W system is the first dedicated die-to-wafer overlay metrology platform to provide 100 percent die overlay measurement with high precision and speeds needed for high volume production environments. The EVG40 D2W system is EVG’s cutting-edge metrology tool for die-to-wafer alignment verification after bonding. It is designed to meet the stringent overlay accuracy requirements of heterogeneous integration and advanced packaging processes. This tool offers high-resolution die-to-wafer overlay measurements at the highest throughput. In contrast to other measurement methods, where only a fraction of the dies are measured, the EVG40 D2W enables 100 percent inspection for improved process control and yield in high-volume manufacturing (HVM). Leveraging state-of-the-art optics and image processing algorithms, the EVG40 D2W delivers overlay measurement capabilities supporting a broad range of distinctive alignment mark layouts and locations, laterally with side-by-side fiducials and vertically enabled by dual focus optics. Supporting a wide range of advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), 2.5D/3D integration, and chiplet-based architectures, the EVG40 D2W empowers engineers with the insights needed to ensure alignment excellence and process reliability.

Features

High throughput (up to 15X higher than EVG’s industry benchmark EVG®40 NT2 system), enabling 100% inspection

Dual Focus enables flexible alignment mark locations vertically

Infrared light allows alignment marks within bond interface

Universal Measurement Process enables side by side fiducials

Free access to measurement data

Up to 5-parameter overlay model providing feedback parameters for process optimization

Explore our Technologies

光刻

纳米压印

键合

量测 EVG®20 EVG®40 NT EVG®40 NT2 EVG®40 D2W EVG®50

EVG®20

EVG®40 NT

EVG®40 NT2