
EVG ® 20
IR Inspection System。IR and bond strength measurement of bonded wafer stacks
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显微镜、成像系统、光学平台与光学测量
消解、萃取、浓缩、纯化、研磨与进样
加热、恒温、干燥、制冷、水浴、烘箱与培养箱
真空系统、泵、阀、气体、流量与液体处理
材料表征、热分析、力学、粒度、表面和物性测试
天平、搅拌、摇床、清洗、灭菌、工作台和常规设备
半导体、电子测量、电源、电池、探针台与微纳加工
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IR Inspection System。IR and bond strength measurement of bonded wafer stacks

Automated Measurement System。Versatile, high-accuracy metrology for bonding and lithography

Automated Measurement System。High-Speed High-Precision Metrology for 3D and Heterogeneous Integration

Die-to-Wafer Overlay Metrology System。Dedicated Die-to-Wafer overlay metrology platform for 100 percent die overlay measurement

Automated Metrology System。High-throughput, high-resolution metrology for bonded stacks and single wafers