EVG ® 501

Wafer Bonding System

Versatile manual wafer bonding system for academia and industrial research

The EVG501 is a highly flexible wafer bonding system and supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes. This versatility is ideal for universities, R&D facilities, or low-volume production. The design of the bond chambers is similar to the EVG high-volume-manufacturing tools, such as the EVG GEMINI, and the bonding recipes are easily transferable, allowing for easy scale up of production volumes.

Features

Unique pressure and temperature uniformity

Compatible with EVG mechanical and optical aligners

Flexible design and configurations for research From single chips to wafers Various processes (eutectic, solder, TLP, direct bonding) Optional turbopump (<1E-5mbar) Upgradeable for anodic bonding Open chamber design for easy conversion and maintenance

From single chips to wafers

Various processes (eutectic, solder, TLP, direct bonding)

Optional turbopump (<1E-5mbar)

Upgradeable for anodic bonding

Open chamber design for easy conversion and maintenance

Pilot production compatible Open chamber design for easy conversion and maintenance Smallest footprint for a 200 mm bonding system: 0.8 m 2 Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Smallest footprint for a 200 mm bonding system: 0.8 m 2

Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems