
EVG ® 501
Wafer Bonding System。Versatile manual wafer bonding system for academia and industrial research
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细胞、分子、生物制药、培养与成像
显微镜、成像系统、光学平台与光学测量
消解、萃取、浓缩、纯化、研磨与进样
加热、恒温、干燥、制冷、水浴、烘箱与培养箱
真空系统、泵、阀、气体、流量与液体处理
材料表征、热分析、力学、粒度、表面和物性测试
天平、搅拌、摇床、清洗、灭菌、工作台和常规设备
半导体、电子测量、电源、电池、探针台与微纳加工
实验室工程、配套系统、家具、管路与辅助系统
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Wafer Bonding System。Versatile manual wafer bonding system for academia and industrial research

Wafer Bonding System。Wafer bonding system for R&D or low-volume production - fully compatible with high-volume-manufacturing equipment

Wafer Bonding System。Single or dual chamber wafer bonding system for low volume production

Automated Wafer Bonding System。Fully automated wafer bonding system for substrates up to 300 mm

Automated Wafer Bonding System。Fully automated wafer bonding system for high-volume manufacturing

Automated High-Vacuum Wafer Bonding System。High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”

Automated Production Wafer Bonding System。Integrated modular high-volume manufacturing system for aligned wafer bonding