EVG ® 520 IS
EVG 520 IS
Wafer Bonding System。Single or dual chamber wafer bonding system for low volume production
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 520 IS，可提供产品参数、报价和售后服务咨询，价格面议。
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Wafer Bonding System
Single or dual chamber wafer bonding system for low volume production
The EVG520 IS is well suited for small-volume-production applications. Redesign based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as excellent temperature and force uniformity, high-force-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.
Features
Fully automated processing with manual loading and unloading including external cooling station
Compatible with EVG mechanical and optical aligners
Single- or double-chamber automated system
Fully automated bond process execution and bond cover movements
Integrated cooling station for high throughput
Options: High vacuum capability (1E-6 mbar) Programmable mass flow controller Integrated cooling
High vacuum capability (1E-6 mbar)
Programmable mass flow controller
Integrated cooling
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