EVG ® 540
EVG 540
Automated Wafer Bonding System。Fully automated wafer bonding system for substrates up to 300 mm
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Automated Wafer Bonding System
Fully automated wafer bonding system for substrates up to 300 mm
The EVG540 system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.
Features
Single-chamber bonder up to 300 mm substrate size
Bond force up to 350 kN
Compatible with SmartView ® and MBA300
Automatic handling of up to four bond chucks
Compliant to high safety standards
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