EVG ® 560
EVG 560
Automated Wafer Bonding System。Fully automated wafer bonding system for high-volume manufacturing
广西科米瑞实验仪器设备有限公司提供 EV Group EVG 560 产品资料、选型咨询、供货报价和售后服务支持，价格面议。
← 返回产品列表
说明
Automated Wafer Bonding System
Fully automated wafer bonding system for high-volume manufacturing
The EVG560 automated wafer bonding system is a highly configurable production bonder. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.
Features
Fully automated processing with automated loading and unloading of bond chucks
Up to four bond chambers for various bonding processes
Bond force up to 350 kN
Compatible with EVG mechanical and optical aligner including SmartView
Simultaneous rapid heating and cooling on top and bottom side
Automatic loading and unloading of bond chambers and cooling station
Remote online diagnostics
FAQ
提交需求
请填写必填信息，我们将在工作日尽快回复。