EVG ® 620 NT

Mask Alignment System (semi-automated / automated)

The EVG ® 620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.

Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. It is an ideal tool for optical double-side lithography available in semi-automated or automated configuration with optional full-housing Gen 2 solution to meet high-volume production requirements and fab standards. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG620 NT or the fully housed EVG620 NT Gen2 mask alignment systems are equipped with integrated vibration isolation, and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

Features

Wafer/substrate size from pieces up to 150 mm/6’’

System design supporting versatility of lithography processes

Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time

Automated contact-free wedge compensation sequence with proximity spacers

Auto origin function for precise centering of alignment key

Dynamic alignment function featuring real-time offset correction

Supports the latest UV-LED technology

Rework sorting wafer management & flexible cassette system

Manual substrate loading capability on automated system

Field upgradeable from semi-automated to fully automated version

Minimized system footprint and facility requirements

Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

Advanced SW features and compatibility between R&D and full-scale production

Agile processing and conversion re-tooling