EVG ® 610
Mask Alignment System。The is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.
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EVG ® 620 NT
Mask Alignment System (semi-automated / automated)。The provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.
EVG ® 6200 NT
Mask Alignment System (semi-automated / automated)。The mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.