EVG ® 6200 NT

Mask Alignment System (semi-automated / automated)

The EVG ® 6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.

Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput, advanced alignment features and optimized total cost of ownership. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG6200 NT or the fully-housed EVG6200 NT Gen2 mask alignment systems are available in semi-automated or automated configuration and equipped with integrated vibration isolation to achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

Features

Wafer/substrate size from pieces up to 200 mm/8’’

System design supporting versatility of lithography processes

Throughput up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode

Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time

Automated contact-free wedge compensation sequence with proximity spacers

Auto origin function for precise centering of alignment key

Dynamic alignment function featuring real-time offset correction

Supports the latest UV-LED technology

Rework sorting wafer management and flexible cassette system

Manual substrate loading capability on automated system

Field upgradeable from semi-automated to fully automated version

Minimized system footprint and facility requirements

Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

Advanced Software features and compatibility between R&D and full-scale production