EVG ® 40 NT2

Automated Measurement System

High-Speed High-Precision Metrology for 3D and Heterogeneous Integration

The EVG ® 40 NT2 automated metrology system provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and die-to-die (D2D) bonding as well as maskless lithography applications. Designed for high-volume production with feedback loops for real-time process correction and optimization, the EVG40 NT2 helps device manufacturers, foundries and packaging houses accelerate the introduction of new 3D/heterogeneous integration products as well as improve yields and avoid scrapping of highly valuable wafers.

Features

Highly precise measurements of critical bonding and lithography process parameters for current and future leading-edge 3D / Heterogeneous Integration applications Alignment verification and monitoring for W2W, D2W, D2D Alignment verification for maskless exposure processes CD measurement and multi-layer thickness measurement

Alignment verification and monitoring for W2W, D2W, D2D

Alignment verification for maskless exposure processes

CD measurement and multi-layer thickness measurement

Highly scalable system that features multiple measurement heads and a high-precision stage designed for high-throughput and high-accuracy (down to the low single-digit nm range)

Explore our Technologies

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量测 EVG®20 EVG®40 NT EVG®40 NT2 EVG®40 D2W EVG®50

EVG®20

EVG®40 NT

EVG®40 NT2

EVG®40 D2W