GEMINI ®
GEMINI
Automated Production Wafer Bonding System。Integrated modular high-volume manufacturing system for aligned wafer bonding
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Automated Production Wafer Bonding System
Integrated modular high-volume manufacturing system for aligned wafer bonding
The GEMINI is a state-of-the-art, fully automated production wafer bonding system that integrates wafer-to-wafer alignment and bonding processes in a modular design. This platform is particularly suited for next-generation MEMS (Micro-Electro-Mechanical Systems) manufacturing up to 300 mm, offering exceptional performance in wafer-level vacuum or overpressure encapsulation but also in advanced system integration. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the GEMINI equipment platform includes up to four bond chambers that ensure excellent bond quality and yield. The equipment provides full flexibility and supports a wide range of processes, including metal, anodic, glass-frit, fusion, and adhesive bonding.
Features
Fully automated and integrated wafer bonding platform
Field-proven SmartView® bond alignment system
Bond force up to 350 kN
High bond pressure uniformity
Rapid heating and cooling
Optimized temperature uniformity
High vacuum and overpressure capability
Accurate chamber pressure control
Modular concept for full process flexibility
Smart process control and data analysis
Simplified, user-friendly interface
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