ALD-150LE™ Thermal ALD Designed for Advanced Research & Development Applications

：The ALD-150LE™ Thin Film Deposition System from Kurt J. Lesker Company is engineered for Ultra High Purity (UHP) thermal Atomic Layer Deposition (ALD) processes. Designed for advanced research and development, this system supports deposition of critical materials for barrier films and devices with High Aspect Ratio (HAR) features.

：Automate Your Lab.

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：Atomic-Scale Precision for Complex 3D Geometry

：Conformal Al 2 O 3 film deposited into trenches of varying aspect ratios. Image courtesy of Bangzhi Liu, Pennsylvania State University

：Conformal HfO 2 film over step. Image courtesy of Bangzhi Liu, Pennsylvania State University

：Conformal Al 2 O 3 film deposited in to trenches. Image courtesy of Bangzhi Liu, Pennsylvania State University

：ALD-150LE Specifications

：Specification

：Substrate Size

：Up to 150mm

：Substrate Loading

：Manual, Open Load

：Substrate Temperature

：Up to 500°C

：Delivery Line and Chamber Temperature

：Up to 250°C

：ALD Process Modes

：Thermal only, Dynamic and Static Exposure for HAR, Variable Residence Mode (VRM)

：Precursor Inlets to Chamber

：Two (2), standard on chamber, independently heated

：Precursor Types