DB12T
DB12T is a state-of-the-art solution for mechanical peel-off de键合 at room temperature, perfectly suited for a wide range of thin wafer applications. Discover now ➤
广西科米瑞实验仪器设备有限公司生产销售 SUSS DB12T,可提供产品参数、报价和售后服务咨询,价格面议。
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Programmable precision
Key Features of DB12T Debonder
DB12T gives you full control over all relevant de键合 parameters – thus minimizing the debond front and maximizing process reliability.
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