XBC300 Gen2 D2W Wafer Bonder
XBC300
XBC300 Gen2 D2W is your fully automated solution for sequential die-to-wafer hybrid 键合 on 200mm and 300mm substrates. Discover now ➤
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Die-to-Wafer hybrid 键合 solution for global production and R&D
Key Features of XBC300 Gen2 D2W Wafer Bonder
Developed in collaboration with our technology partner SET Corporation SA, the XBC300 Gen2 D2W is particularly suited for the needs of R&D lines, research and technology organizations (RTOs), as well as low volume manufacturing (LVM).
Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.
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