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900i Series In-Line Sputtering Systems

900i Series

Precision Batch Sputtering for Application-Critical Thin Films

品牌: Kurt J. Lesker价格: 面议服务区域: 全国

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900i Series In-Line Sputtering Systems

:Precision Batch Sputtering for Application-Critical Thin Films

:KDF is a leading developer and manufacturer of in-line sputtering systems, known for delivering reliable, high-throughput solutions across a wide range of industries. All KDF systems are engineered for versatility and performance at the industry's lowest cost of ownership. These systems are widely used in:

:Mainstream silicon

:Emerging materials

:Flat panel displays

:Optical communications

:Medical devices

:KDF's in-line batch sputtering platforms are easier to operate and maintain than cluster tools. They offer measurable improvements in film uniformity, throughput consistency, process stability, and tool up time. Customers also benefit from enhanced automation, environmental health and safety performance, and a strong return on investment.

:KDF partners closely with customers to develop tailored solutions that meet specific production goals. Whether optimizing for throughput, ROI, or time to market, KDF supports all existing equipment with upgrades and retrofits. As the OEM for MRC batch systems, KDF also provides full parts and service support for MRC products worldwide.

:900i Series Highlights

:The 900i Series comprising models 903i, 943i, 943ix, 954i, and 954ix is designed to meet the most demanding production requirements while offering the process flexibility typically found in R&D systems. These tools are ideal for thin film deposition in application-critical devices where uniformity and repeatability are essential.

:The system features a horizontal cathode and substrate orientation, which allows for gentle fixturing and supports a wide range of substrate sizes. It accommodates a 12 inch by 12-inch substrate area and can process substrates up to 1.5 inches thick, with optional hardware available for 2 inch substrates. The 900i Series supports high-rate DC magnetron sputtering and both single- and multiple-pass deposition modes.

:Users can process one 300 mm wafer or multiple smaller wafers per run, with convenient wafer-to-pallet loading. Optional configurations include a high-vacuum loadlock with quartz heater lamps for efficient substrate degassing, a planetary substrate pallet for enhanced film uniformity, and an integrated RGA for gas peak monitoring and process fault detection.

:Cathode Technology

:The 900i Series supports a wide range of cathode configurations to meet diverse material and process requirements.

:Planar: RF and DC sputtering of all materials, targets bonded to copper backing plate

:Inset: Upsilon or Mu for DC sputtering of metals with enhanced utilization, targets clamped to cooling well

:Mark II: planar style cathode with optimized magnets for dielectric sputtering

:Magterial: planar style cathode with high strength magnets for sputtering magnetic materials

:LMM: Linear Moving Magnet, engineered for high-rate reactive processes, full-face erosion, and minimal particle generation

:Optional gas delivery systems are available to support advanced reactive sputtering applications.

:Enhanced Rotary Planetary Pallet (ERPP™)

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