974i Series In-Line Sputtering Systems

：Advanced Batch Sputtering for High-Precision Thin Film Applications

：KDF designs and manufactures some of the most reliable in-line sputtering systems available today. Each system is built to deliver high throughput, process versatility, and low cost of ownership across a wide range of industries including:

：Mainstream silicon

：Emerging materials

：Flat panel displays

：Optical communications

：Medical devices

：KDF's in-line batch sputtering platforms are easier to operate and maintain than cluster tools. These systems provide measurable improvements in film uniformity, throughput consistency, process stability, and tool uptime. Customers benefit from enhanced automation, increased reliability, and improved environmental health and safety performance.

：KDF works closely with its customers to develop tailored solutions that meet specific production goals. Whether optimizing throughput, return on investment, or time to market, KDF supports all existing equipment with upgrades and retrofits. As the OEM for MRC batch systems, KDF also provides complete parts and service support for MRC products worldwide.

：974i Series Highlights

：The 974i Series is engineered to meet the most demanding production requirements while offering the flexibility typically found in research and development systems. These tools are ideal for thin film deposition in application-critical devices where uniformity and repeatability are essential.

：The system features a horizontal cathode and substrate orientation, allowing gentle fixturing and support for varied substrate sizes. It accommodates a 20-inch by 20-inch substrate area and can process substrates up to 2 inches thick. The 974i Series supports high-rate DC magnetron sputtering and both single- and multiple-pass deposition modes.

：Users can process one Gen 2.5 substrate per pallet, and throughput for 200 mm wafer metallurgy is four times greater than that of the 900i Series. A high-vacuum load lock with quartz heater lamps ensures efficient substrate degassing. Optional configurations include a planetary substrate pallet for enhanced film uniformity and an integrated RGA for gas peak monitoring and process fault detection.

：Cathode Technology

：The system features KDF's latest cathode designs, extended to 24.5 inches for improved uniformity across the entire pallet including:

：Planar: RF and DC sputtering of all materials, targets bonded to copper backing plate

：Inset: Upsilon or Mu for DC sputtering of metals with enhanced utilization, targets clamped to cooling well

：Mark II: planar style cathode with optimized magnets for dielectric sputtering

：Magterial: planar style cathode with high strength magnets for sputtering magnetic materials

：LMM: Linear Moving Magnet, engineered for high-rate reactive processes, full-face erosion, and minimal particle generation

：Enhanced Rotary Planetary Pallet (ERPP™)

：For applications requiring exceptional film uniformity, the 974i Series can be equipped with KDF's proprietary Enhanced Rotary Planetary Pallet (ERPP™). When paired with KDF's cathodes, this configuration achieves uniformities better than ±1 percent across the pallet and repeatability better than 0.5 percent between runs for dielectric materials such as SiO 2 and TiO 2 . This represents a significant improvement over traditional pallet uniformities of ±15 to 20 percent.