Esco 西林瓶灌装加塞（轧盖）机
西林瓶灌装加塞（轧盖）机适用于多品种无菌产品的研发和中试生产，针对单抗类、XDC类、基因治疗/细胞治疗、生物制品等产品提供完美的无菌保护。
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EVG ® 20
IR Inspection System。IR and bond strength measurement of bonded wafer stacks
EVG ® 40 NT
Automated Measurement System。Versatile, high-accuracy metrology for bonding and lithography
EVG ® 40 NT2
Automated Measurement System。High-Speed High-Precision Metrology for 3D and Heterogeneous Integration
EVG ® 40 D2W
Die-to-Wafer Overlay Metrology System。Dedicated Die-to-Wafer overlay metrology platform for 100 percent die overlay measurement
EVG ® 50
Automated Metrology System。High-throughput, high-resolution metrology for bonded stacks and single wafers
EVG ® 610
Mask Alignment System。The is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.
EVG ® 620 NT
Mask Alignment System (semi-automated / automated)。The provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer s...
EVG ® 6200 NT
Mask Alignment System (semi-automated / automated)。The mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.
LITHOSCALE ®
Maskless Exposure Lithography System。is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of microfabrication app...
LITHOSCALE ® XT
High Throughput Maskless Exposure Lithography System。is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of micr...
EVG ® 101
Advanced Resist Processing System。The perfect solution for single-wafer resist processing in R&D and small-scale production
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