HERCULES ®
Lithography Track System。The is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator...
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EVG ® 320 D2W
Automated Die Preparation and Activation System。Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) ...
GEMINI ® FB
Automated Collective Die-to-Wafer Bonding System。High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding
HEX Mini
Download Brochure THE HEX MINI Single Source Desktop PVD Coater The HEX Mini is Korvus Technology’s compact, entry-level PVD (physical vapour deposition) sys...
- 型号或系列
- HEX Mini
- 产品类别
- Desktop PVD coater
- Maximum Sample Size (Diameter)
- 2" (50mm) Source: DC Sputtering Magnetron Sputter Size (Diameter): 2" Power Supply: 208W, 650V / 0.32A Base Pressure: <5×10-6 mbar* Chamber Volume: 3 L
- Maximum Sample Size Diameter
- 2" (50mm) Source: TES Thermal Evaporator Power Supply: 720W, 72A / 10V Base Pressure: <5×10-6 mbar* Chamber Volume: 3 L Optional Thickness Monitoring
X射线光电子能谱仪（XPS）
操作界面可在同一个屏幕内设置常规和高级的多功能测试参数，同时保留诸如进样照片导航和 SXI 二次电子影像精准定位等功能。多数量样品大面积分析 ·把制备好样品的样品托放进进样腔室后将自动传送进分析腔室内 ·可同时使用三个样品托 ·80mmx80mm 的大样品托可放置多数量样品 ·可分析粉末、粗糙表面、绝缘体、形状复...
- 型号
- PHI GENESIS 500
- 分析技术
- XPS、UPS、LEIPS、REELS、AES、GCIB
- 微区X射线束斑
- < 5um
- 样品托尺寸
- 80mmx80mm
俄歇电子能谱仪（AES）
产品特点 ·使用CMA同轴分析器，同时实现高灵敏度和高传输率。即使在低电流高空间分辨率情况下，都可轻松的进行分析。·以20kV加速电压和电流1nA进行俄歇分析，AES空间分辨率可达≤8nm
- 型号
- PHI 710
- 分析器
- CMA同轴筒镜分析仪
- 俄歇分析条件
- 20kV加速电压，电流1nA
- AES空间分辨率
- ≤8nm
LuXpector THEA
Cost-Efficient Operation: Reduced total cost of ownership (TCO) through intelligent design, modular components, and low maintenance requirements.
- Model / product family
- LuXpector THEA
- 产品类别
- Wafer Inspection / Ellipsometry
- Footprint
- 2,500 x 1,520 mm (incl. FOUPs)
- Electrical connection
- 230 V, 50-60 Hz, 2,5 kVA
SIRD SiC 200
Scanning InfraRed Depolarization。Features at a glance。Stress Measurement Quantitative stress measurement on wafer level
- Model / product family
- SIRD SiC 200
- 产品类别
- Wafer Inspection / Scanning Infrared Depolarization
- Principle
- Stress-induced optical birefringence
- Stress Sensitivity
- ≥ 0.1 kPa in-plane shear stress
SIRD
Wafer Inspection。Scanning InfraRed Depolarization。Functional Description。A robot transfers the wafer from the carrier to the measurement stage. The carrier c...
- Model / product family
- SIRD
- 产品类别
- Wafer Inspection / Scanning Infrared Depolarization
- Principle
- Stress-induced optical birefringence
- Stress sensitivity
- ≥ 0.1 kPa in-plane shear stress
Wafer Surface Measurement System
Vapor Phase Decomposition。Features at a glance。All media, from process chemicals to ICP-MS calibration, are supplied fully automatically by the system.
- Model / product family
- Wafer Surface Measurement System
- 产品类别
- Wafer Inspection / Vapor Phase Decomposition
- Wafer sizes
- 4" - 12"
- Surfaces
- Hydrophobic/hydrophilic/bevel/upper bevel
Wafer Surface Preparation System
Vapor Phase Decomposition。Features at a glance。Layout for maximum robustness against cross-contamination.
- Model / product family
- Wafer Surface Preparation System
- 产品类别
- Wafer Inspection / Vapor Phase Decomposition
- Wafer sizes
- 4" - 12"
- Surfaces
- Hydrophobic/hydrophilic/bevel/upper bevel
AIXTRON AIX G5 WW C 碳化硅化合物半导体沉积系统
将 AIX G5 WW C 定义为化合物半导体沉积系统，面向下一代 SiC 功率电子应用。写明该系统以批量外延的高吞吐量结合单片晶圆控制，目标是在同一设备方案中兼顾产能和外延层质量
- 型号
- AIX G5 WW C
- 应用材料
- SiC
- 工艺方向
- 批量外延与单片晶圆控制
- 配置
- 8x150 mm，单片晶圆旋转
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