EVG ® 520 IS
Wafer Bonding System。Single or dual chamber wafer bonding system for low volume production
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EVG ® 301
Single Wafer Cleaning System。R&D type single wafer cleaning system
EVG ® 320
Automated Single Wafer Cleaning System。Automated single wafer cleaning system for efficient removal of particles
EVG ® 810 LT
LowTemp™ Plasma Activation System。Low-temperature plasma activation system for SOI, MEMS, compound semiconductors and advanced substrate bonding
EVG ® 850 LT
Automated Production Bonding System for SOI and Direct Wafer Bonding
EVG ® 850
Automated Production Bonding System for SOI。Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
GEMINI ® FB
Automated Production Wafer Bonding System。Integrated platform for high precision alignment and fusion bonding
BONDSCALE ®
Automated Production Fusion Bonding System。Enabling 3D Integration for More Moore
EVG ® 540
Automated Wafer Bonding System。Fully automated wafer bonding system for substrates up to 300 mm
EVG ® 560
Automated Wafer Bonding System。Fully automated wafer bonding system for high-volume manufacturing
ComBond ®
Automated High-Vacuum Wafer Bonding System。High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”
GEMINI ®
Automated Production Wafer Bonding System。Integrated modular high-volume manufacturing system for aligned wafer bonding
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