EVG ® 560
Automated Wafer Bonding System。Fully automated wafer bonding system for high-volume manufacturing
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ComBond ®
Automated High-Vacuum Wafer Bonding System。High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”
GEMINI ®
Automated Production Wafer Bonding System。Integrated modular high-volume manufacturing system for aligned wafer bonding
EVG ® 880 LayerRelease™
Automated Layer Release System。The EVG®880 LayerRelease™ System is a fully automated system and enables precise release of layers from silicon carrier substr...
EVG ® 805
Debonding System。Thin wafer debonding。The EVG805 is a system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carri...
EVG ® 850 TB
Automated Temporary Bonding System。Fully automated temporary wafer bonding of a substrate on a rigid carrier
EVG ® 850 DB
Automated Debonding System。Fully automated debonding, cleaning and unloading of thin wafers
EVG ® 320 D2W
Automated Die Preparation and Activation System。Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) ...
GEMINI ® FB
Automated Collective Die-to-Wafer Bonding System。High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding
EVG ® 610 BA
Bond Alignment System。Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research
EVG ® 620 BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for research and pilot production
EVG ® 6200∞ BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for pilot and volume production
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