Simultix 15
多元素同步分析型波长色散 X 射线荧光光谱仪。Simultix15 结构紧凑、智能化程度高，是一款功能强大的元素分析工具，在许多工业领域都表现出卓越的性能。40 多年来，理学 Simultix 同步波长色散 X 射线荧光（WDXRF）光谱仪系统已被广泛用作元素分析工具，用于钢铁和水泥等要求高通量和高精度的行业的过程控制
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Supermini200
高功率台式扫描型波长色散X射线荧光光谱仪。固体、液体、粉末、合金和薄膜的元素分析。与同类 XRF仪器相比，理学 兼具高分辨率与紧凑设计。作为一款高功率台式扫描型波长色散 X 射线荧光（WDXRF）光谱仪，能够分析几乎所有材料中从氧（O）到铀（U）的元素，其独特之处在于同时实现低拥有成本（COO）、高分辨率和低检测限（LLD）
ZSX Primus III NEXT
用于工业应用的扫描型波长色散 X 射线荧光光谱仪。理学 通过定量测定粉末和固体样品中从 Be 到 Cm 的广泛范围元素，提供快速的元素工业质量控制。这款新型扫描波长色散 X 射线荧光光谱仪采用理学独特的 X 射线管上方配置，建立在成功的 ZSX Primus 系列平台之上
ZSX Primus IV
上照式扫描型波长色散 X 射线荧光光谱仪。固体、液体、粉末、合金和薄膜的元素分析。作为一款上照式扫描型波长色散 X 射线荧光（WDXRF）光谱仪，理学 可对多种类型样品进行快速定量分析，测定从铍（Be）到锔（Cm）的主量元素与微量元素，且对标准品的依赖极低
ZSX Primus IVi
下照式顺序型波长色散 X 射线荧光光谱仪。液体、合金和镀层金属的全面精准 X 射线分析。这款下照式高性能光谱仪可对液体、合金和镀层金属等样品进行全面精准的分析。ZSX Primus IV𝒾 波长色散 X 射线荧光光谱仪配备业界最薄的 30 微米标准铍（Be）窗，结合卓越的分析性能与灵活配置，为复杂样品分析提供理想平台，实现优异的轻元素（低 Z 值）检测限
scia Mill 150
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 150
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 150 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 165° in 0.1° steps
scia Mill 200
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 200
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 200 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
scia Mill 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 300
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 300 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
scia Trim 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Trim 300
- Product category
- Ion Beam Trimming
- Substrate size (up to)
- 300 mm dia., all standard wafer sizes possible
- Substrate holder
- Water-cooled, helium backside cooling contact, electrostatic clamping without edge exclusion
scia Finish 1500
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Finish 1500
- Product category
- Ion Beam Trimming
- Substrate size (up to)
- 1500 mm dia., 400 kg
- Axis performance
- Max. velocity 0.15 m/s, max. acceleration 15 m/s²
scia Coat 500
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Coat 500
- Product category
- Ion Beam Sputtering
- Substrate size (up to)
- 500 mm x 300 mm, 300 mm dia. for rotation
- Substrate holder
- Linear movement from 0.1 mm/min up to 15 mm/s, rotation up to 300 rpm (max. 300 mm dia.)
scia Opto 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Opto 300
- Product category
- Ion Beam Sputtering
- Substrate size (up to)
- 300 mm dia.
- Substrate holder
- Substrate rotation up to 60 rpm, includes optical thickness monitor (OTM) and test glass changer
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